ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating temperature of 150°C and has an enhanced thermal conductivity value in comparison to other encapsulants of 1.20W/m.K.

It is a filled resin system, however the viscosity of the mixed system is low in comparison to other resins with a similar filler loading. This allows the mixed resin to be easily mixed and can flow between components and devices with limited spacing. The fillers used in this resin are also non-abrasive meaning that there is less wear on dispensing machinery.

ER2221 is an excellent choice for encapsulating an electronic device which requires high levels of thermal resistance and protection such as automotive, aerospace, industrial or other applications which are subject to harsh environments.